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600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 1 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited figure 1. package types of ap2318 soic-8 general description the ap2318 is a series of ultra low dropout regulators optimized for low voltage app lications where transient response and minimum input voltage are critical. the ap2318 provides current limit and thermal shutdown. its circuit includes a trimmed bandgap reference to assure out put voltage accuracy to be within 1%. on-chip thermal shutdown provides protection against any comb ination of overload and ambient temperatures th at would create excessive junction temperatures. the ap2318 has both fixed and adjustable versions. the 1.3v fixed versions integrate the corresponding resistor divider. the adjustable version can set the output voltage through two external resistors. the ap2318 is available in the standard dfn-3 3-8 and soic-8 packages. features wide operating voltage ranges: 2.5v to 12v output voltage accuracy: 1% on-chip thermal shutdown esd: human body model 3kv machine model 600v operating junction temperature: -40 o c to 125 o c applications notebook usb device add-on card dvd player pc motherboard dfn-3 3-8
600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 2 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited 1 2 3 45 6 7 8 figure 2. pin configuration of ap2318 (top view) pin configuration functional block diagram figure 3. functional block diagram of ap2318 dn package (dfn-3x3-8) v out v in v out en nc gnd adj/nc v in m package (soic-8) nc nc en v in v in adj/nc gnd v out 1 2 3 4 8 7 6 5 thermal shutdown current limit error amplifier bandgap reference enable rc compensation ovp connect a1 and a2, disconnect b: fixed voltage version connect b, disconnect a1 and a2:adjustable voltage version a2 b 1, 2 (3, 4) 3, 4 (6) 5 (7) 6 (8) 8 (2) v fb v in v out adj/nc gnd en a1 a (b) a: dfn-3 x 3-8 b: soic-8
600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 3 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited ordering information circuit type package dn: dfn-3 3-8 m: soic-8 adj: adjustable output 1.3: fixed output 1.3v e1: lead free g1: green ap2318 - tr: tape and reel blank: tube bcd semiconductor's pb-free products, as de signated with "e1" suffix in the part number, are rohs compliant. products with "g1" suffix are available in green packages. package temperature range part number marking id packing type lead free green lead free green soic-8 -40 to 125 o c ap2318m-adje1 ap2318m-adjg1 2318m-adje1 2318m-adjg1 tube ap2318m-adjtre1 ap2318m-adjtrg1 2318m-adje1 2318m-adjg1 tape & reel ap2318m-1.3e1 ap2318m-1.3g1 2318m-1.3e1 2318m-1.3g1 tube ap2318m-1.3tre1 ap2318m-1.3trg1 2318m-1.3e1 2318m-1.3g1 tape & reel dfn-3 3-8 -40 to 125 o c ap2318dn-adjtre1 ap2318dn-adjtrg1 f9e b9e tape & reel ap2318dn-1.3tre1 ap2318dn-1.3trg1 f9b b9b tape & reel pin description pin number pin name function dfn-3 3-8 soic-8 1, 2 3, 4 v in input voltage 3, 4 6 v out output voltage 5 7 adj/nc adjust voltage/no connection 6 8 gnd ground 7 1, 5 nc no connection 8 2 en on/off control
600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 4 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited recommended operating conditions note 1: stresses greater than those listed under "absolute maximum ratings" ma y cause permanent damage to the device. these are stress ratings only, and functi onal operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to "absolute maximum ra tings" for extended periods may affect device reliability. note 2: absolute maximu m ratings indicate limits beyond which damage to the component ma y occur. electrical specifica- tions do not apply when operating the device outside of its operating ra tings. the maximum allowabl e power dissipation is a function of the maximum junction temperature, t j (max) , the junction-to-ambient thermal resistance, ja, and the ambient tem- perature, t a. the maximum allowable power diss ipation at any ambient temperat ure is calculated using: p d (max)=(t j (max) - t a )/ ja. exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. parameter symbol value unit input voltage v in 15 v operating junction temperature t j 150 o c storage temperature range t stg -65 to 150 o c lead temperature (soldering, 10sec) t lead 260 o c thermal resistance (note 2) ja soic-8 135 o c/w dfn-3 3-8 120 esd (human body model) esd 3000 v esd (machine model) esd 600 v parameter symbol min max unit input voltage v in 2.5 12 v enable voltage v en 12 v operating junction temperature range t j -40 125 o c absolute maximum ratings (note 1)
600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 5 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited parameter symbol conditions min typ max unit reference voltage v ref ap2318-adj i out =10ma, v in -v out =2v, t j =25 o c 10ma i out 600ma, v out +2v v in 12v 0.792 0.784 0.800 0.800 0.808 0.816 v output voltage v out i out =10ma, v in =2.5v, t j =25 o c 10ma i out 600ma, 2.5v v in 12v -1% -2% 1% 2% v maximum output current i out (max) v in -v out =2v 0.85 1.2 a line regulation v rline ap2318-adj i out =10ma, v out +2v v in 12v 0.05 0.2 %/v i out =10ma, 2.5v v in 12v 1 6 mv load regulation v rload ap2318-adj v in =v out +2v, 10ma i out 600ma 0.2 0.4 % v in =2.5v, 10ma i out 600ma 1 10 mv dropout voltage v drop ? v out ( ? v ref )=1%, i out =600ma 0.35 v adjust pin current i adj 0.05 1 a minimum load current i load (min) v out +2v v in 12v (adj only) 1.7 5 ma quiescent current i q v in =v out +2v, i out =0ma 250 a rms output noise (% of v out ) v noi t a =25 o c, 10hz f 20khz 0.003 % thermal shutdown temperature 150 o c thermal shutdown hysteresis 25 o c enable input voltage v en enable logic low 0.8 v enable logic high 2.25 enable input current i en v en =2.25v 515 a v en =0.8v 4 a thermal resistance, (junction to case) jc dfn-3 3-8 15 o c/w soic-8 24 electrical characteristics operating conditions: 2.5v v in 12v, c in =1 f, c out =2.2 f, t j =25 o c, unless otherwise specified. (p maxi- mum power dissipation). limits appearing in boldface type apply over the entire junction temperature range for operation of -40 o c to 125 o c.
600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 6 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited typical performance characteristics figure 4. output vo ltage vs. output current (conditions: v out =0.8v, adj short to gnd) figure 5. output voltage vs. output current (conditions: v out =1.2v, r1=3k ? , r2=6.2k ?) figure 7. output voltage vs. output current (conditions: v out =1.2v, r1=3k ? , r2=6.2k ?) figure 6. output voltage vs. output current (conditions: v out =0.8v, adj short to gnd) 0 150 300 450 600 750 900 1050 1200 1350 1500 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 ap2318-adj v out =1.2v r1=3k ? r2=6.2k ? t c =25 o c output voltage (v) output current (ma) v in =3.2v v in =2.5v v in =12v 0 50 100 150 200 250 300 0.70 0.72 0.74 0.76 0.78 0.80 0.82 0.84 0.86 0.88 0.90 ap2318-adj v out =0.8v adj short to gnd t c =25 o c output voltage (v) output current (ma) v in =2.8v 0 50 100 150 200 250 300 1.10 1.12 1.14 1.16 1.18 1.20 1.22 1.24 1.26 1.28 1.30 ap2318-adj v out =1.2v r1=3k ? r2=6.2k ? t c =25 o c output voltage (v) output current (ma) v in =3.2v 0 150 300 450 600 750 900 1050 1200 1350 1500 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 ap2318-adj v out =0.8v adj short to gnd t c =25 o c output voltage (v) output current (ma) v in =3.2v v in =8v v in =12v
600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 7 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited typical performance ch aracteristics (continued) figure 8. output voltage vs. output current (conditions: v out =0.8v, adj short to gnd) figure 9. output voltage vs. output current (conditions: v out =1.2v, r1=3k ? , r2=6.2k ?) figure 11. output voltage vs. input voltage (conditions: v out =1.2v, r1=3k ? , r2=6.2k ?) figure 10. output voltage vs. input voltage (conditions: v out =0.8v, adj short to gnd) 0 150 300 450 600 750 900 1050 1200 1350 1500 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 ap2318-adj v in =2.8v v out =0.8v adj short to gnd output voltage (v) output current (ma) t c =25 o c t c =-40 o c t c =125 o c 0 150 300 450 600 750 900 1050 1200 1350 1500 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 ap2318-adj v in =3.2v v out =1.2v r1=3k ? r2=6.2k ? output voltage (v) output current (ma) t c =25 o c t c =-40 o c t c =125 o c 0123456789101112 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 ap2318-adj v out =1.2v r1=3k ? r2=6.2k ? t c =25 o c output voltage (v) input voltage (v) 300ma 10ma 600ma 0123456789101112 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 ap2318-adj v out =0.8v adj short to gnd t c =25 o c output voltage (v) input voltage (v) 300ma 10ma 600ma
600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 8 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited typical performance ch aracteristics (continued) figure 12. output voltage vs. case temperature (conditions: v out =0.8v, adj short to gnd) figure 13. output voltage vs. case temperature (conditions: v out =1.2v, r1=3k ? , r2=6.2k ?) figure 15. supply voltage vs. input voltage (conditions: v out =1.2v, r1=3k ? , r2=6.2k ?) figure 14. supply voltage vs. input voltage (conditions: v out =0.8v, adj short to gnd) -40 -20 0 20 40 60 80 100 120 0.70 0.72 0.74 0.76 0.78 0.80 0.82 0.84 0.86 0.88 0.90 ap2318-adj v in =2.8v v out =0.8v adj short to gnd i out =10ma output voltage (v) case temperature ( o c) 012345678 0 25 50 75 100 125 150 175 200 225 250 ap2318-adj v out =0.8v adj short to gnd no load t c =-40 o c t c =25 o c t c =125 o c supply current ( a) input voltage (v) 012345678 0 50 100 150 200 250 300 350 400 ap2318-adj v out =1.2v r1=3k ? r2=6.2k ? no load t c =-40 o c t c =25 o c t c =125 o c supply current ( a) input voltage (v) -40-20 0 20406080100120 1.10 1.12 1.14 1.16 1.18 1.20 1.22 1.24 1.26 1.28 1.30 ap2318-adj v in =3.2v v out =1.2v r1=3k ? r2=6.2k ? i out =10ma output voltage (v) case temperature ( o c)
600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 9 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited typical performance ch aracteristics (continued) figure 16. supply current vs. case temperature (conditions: v out =0.8v, adj short to gnd) figure 17. supply current vs. case temperature (conditions: v out =1.2v, r1=3k ? , r2=6.2k ?) figure 19. supply current vs. output current (conditions: v out =1.2v, r1=3k ? , r2=6.2k ?) figure 18. supply current vs. output current (conditions: v out =0.8v, adj short to gnd) -40-20 0 20406080100120 180 184 188 192 196 200 204 208 212 216 220 ap2318-adj v in =2.8v v out =0.8v adj short to gnd no load supply current ( a) case temperature ( o c) -40-20 0 20406080100120 300 304 308 312 316 320 324 328 332 336 340 ap2318-adj v in =3.2v v out =1.2v r1=3k ? r2=6.2k ? no load supply current ( a) case temperature ( o c) 0 150 300 450 600 750 900 1050 1200 1350 1500 0 2 4 6 8 10 12 14 16 18 20 ap2318-adj v in =2.8v v out =0.8v adj short to gnd t c =25 o c t c =-40 o c t c =125 o c supply current (ma) output current (ma) 0 150 300 450 600 750 900 1050 1200 1350 1500 0 2 4 6 8 10 12 14 16 18 20 t c =25 o c t c =-40 o c t c =125 o c ap2318-adj v in =3.2v v out =1.2v r1=3k ? r2=6.2k ? supply current (ma) output current (ma)
600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 10 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited typical performance ch aracteristics (continued) figure 20. supply current vs. output current (conditions: v out =0.8v, adj short to gnd) figure 21. supply current vs. output current (conditions: v out =1.2v, r1=3k ? , r2=6.2k ?) figure 23. load transient response figure 22 . load transient response (conditions: v in =2.5v, v out =1.3v, i out =1ma to 300ma, 0 150 300 450 600 750 900 1050 1200 1350 1500 0 2 4 6 8 10 12 14 16 18 20 ap2318-adj v out =0.8v adj short to gnd t c =25 o c v in =3.2v v in =8v v in =12v supply current (ma) output current (ma) 0 150 300 450 600 750 900 1050 1200 1350 1500 0 2 4 6 8 10 12 14 16 18 20 ap2318-adj v out =1.2v r1=3k ? r2=6.2k ? t c =25 o c v in =3.2v v in =2.5v v in =12v supply current (ma) output current (ma) c in =1 f, c out =2.2 f) (conditions: v in =2.5v, v out =1.8v, i out =1ma to 600ma, c in =1 f, c out =2.2 f) ? v out (50mv/div) i out (100ma/div) ? v out (100mv/div) i out (200ma/div) time (200 s/div) time (200 s/div)
600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 11 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited figure 24. line transient response figure 25. line transient response figure 26. psrr vs. frequency figure 27. psrr vs. frequency typical performance ch aracteristics (continued) 10 100 1k 10k 100k 0 10 20 30 40 50 60 70 80 90 100 psrr (db) frequency (hz) ap2318-adj v out =1.2v v in =3 to 4v c in =1 f, c out =2.2 f i load =10ma 10 100 1k 10k 100k 0 10 20 30 40 50 60 70 80 90 100 psrr (db) frequency (hz) ap2318-adj v out =0.8v v in =3 to 4v c in =1 f, c out =2.2 f i load =10ma (conditions: v in =2.5v to 5v, v out =0.8v, i out =10ma, c in =0 f, c out =2.2 f) (conditions: v in =2.5v to 10v, v out =0.8v, i out =10ma, c in =0 f, c out =2.2 f) ? v in (50mv/div) ? v out (2v/div) ? v in (50mv/div) ? v out (5v/div)
600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 12 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited figure 28. power dissipation vs. ambient temperature figure 29. output voltage vs. enable input voltage typical performance ch aracteristics (continued) 30 40 50 60 70 80 90 100 110 120 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 ap2318-adj v in =3.2v v out =1.2v r1=3k ? r2=6.2k ? soic-8 c in =1 f c out =2.2 f power dissipation (w) ambient temperature ( o c) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 ap2318-adj v out =1.2v v in =3.3v r1=3k ? r2=6.2k ? t c =25 o c output voltage (v) enable input voltage (v) i out =10ma (conditions: v out =1.2v, r1=3k ? , r2=6.2k ?) (conditions: v out =1.2v, r1=3k ? , r2=6.2k ?)
600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 13 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited typical applications figure 30. typical applications of ap2318 adj version, v out =0.8*(r1+r2)/r2 figure 31. typical applications of ap2318 fixed 1.3v version, v out =1.3v + + ap2318-adj v out v in en adj/ nc gnd v out v in c in 1 f c out 2.2 f r1 r2 + + ap2318-1.3 v out v in en adj/ nc gnd v out =1.3v v in =3.3v c in 1 f c out 2.2 f
600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 14 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited mechanical dimensions unit: mm(inch) soic-8 0 8 1 5 r 0 . 1 5 0 ( 0 . 0 0 6 ) r0.150(0.006) 1.000(0.039) 0.330(0.013) 0.510(0.020) 1.350(0.053) 1.750(0.069) 0.100(0.004) 0.300(0.012) 0.900(0.035) 0.800(0.031) 0.200(0.008) 3.800(0.150) 4.000(0.157) 7 7 2 0 : 1 d 1.270(0.050) typ 0.190(0.007) 0.250(0.010) 8 d 5.800(0.228) 6.200(0.244) 0.675(0.027) 0.725(0.029) 0.320(0.013) 8 0.450(0.017) 0.800(0.031) 4.700(0.185) 5.100(0.201) note: eject hole, oriented hole and mold mark is optional.
600ma low dropout linear regulator ap1117m data sheet 600ma uldo regulator with enable ap2318 15 dec. 2010 rev. 1. 5 bcd semiconductor manufacturing limited mechanical dimens ions (continued) dfn-3x3-8 unit: mm(inch) 2.900(0.114) 3.100(0.122) 2.900(0.114) 3.100(0.122) 2.200(0.087) 2.400(0.094) 1.400(0.055) 1.600(0.063) n8 n5 n4 n1 0.375(0.015) 0.575(0.023) 0.180(0.007) 0.300(0.012) 0.153(0.006) 0.253(0.010) 0.000(0.000) 0.050(0.002) 0.700(0.028) 0.800(0.031) pin #1 identification b s c 0 . 6 5 0 ( 0 . 0 2 6 ) pin 1 dot by marking
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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